DMG TECO

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TECO is the innovative total-etch bonding system from DMG.
1225 2400
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. Besides its excellent bond strength properties, TECO (= Total Etch Control) stands out thanks to its unique DMG patented single dose application form: the »SilvR dose«. The material is freshly activated by simply pressing on the silver chamber and can be used immediately. Application is carried out in just one step – with one hand, quickly and cleanly

COMPOSITION:

TECO: Bis-GMA-based resin matrix, starter, additives

DMG Etching Gel: o-phosphoric acid in water (37 %), Aerosil

INDICATIONS:

Light-curing dentine and enamel bonding agent in conjunction with the total etch technique for use with light-curing composites and compomers for direct and indirect restorations of cavity classes I - V

CONTRAINDICATIONS:

  • Etching the affected areas of dentine is an important component of the application of the material
  • Do not use the material without dentine etching
  • Do not use with chemically curing composites or compomers
  • Do not use with dual-curing composites or compomers if these are not lightcured
  • Do not use in cases of allergies to any of the components or in the event of contact allergies
  • Do not use directly on exposed pulp or in the case of existing pulpitis.
  • Reliable bonding with push-button convenience. Get the reliability you need with the dependability of a total etch bonding system in an innovative singledose dispenser with TECO.

    Outstanding bonding properties:

    TECO offers a microtensile bond strength of 38 Mpa* – far superior to the accepted industry standard for optimal adhesion. Its non-acetone formulation works with all curing lights.

    Unique fast and easy application system

    The bonding material is activated by a simple push on the patented “SilvR” single-dose package and may be used immediately. The built-in micro brush applicator easily slides out of the SilvR dose capsule. Application is a one-step, one-hand, fast, clean and safe process.

    Proven Total Etch technology

    TECO can be used with a wet or moist bonding technique. The Total Etch method ensures exceptional bond strength and durability

    Interactions with other materials

    Do not use together with substances which inhibit polymerization. This is especially valid for products which contain eugenol, such as temporary cements

    Instructions for use

    Light-curing units should have an output of 450 nm and should be checked regularly The light intensity should be a minimum of 400 mW/cm2

     

     

    • Place the light as close as possible to the material
    • Observe the manufacturer’s instructions for the light unit
    • Ensure that the etched or bonded surface does not become recontaminated prior to each subsequent working step
    • Do not remove the oxygen inhibition layer caused by the application because this is important for the bonding process with the material applied on top
    • It is essential to use etching gel on the affected enamel and dentine surfaces
    • Due to the fact that excess material may collect between the tooth and matrix (pooling effect), if possible use a matrix only after the bond has been applied
    • Observe the manufacturer’s instructions for any other materials that are used with TECO.

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

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